Japan's electroplating project began to provide the world's first liquid crystal driver IC packaging technology plating solution
Tokyo, Sept 7, 2010 - (Asia-Pacific Business News) - Tanaka Precious Metals Group (Head Office: Marunouchi, Chiyoda-ku, Chairman: Okamoto Yoshimi) published the following information on new technologies. Electroplating Engineers of Japan Ltd. (Head Office: Hiratsuka-shi, Kanagawa Prefecture, Chairman (Representative Director): Naito Kazuyoshi, hereinafter referred to as EEJA) since September 8, 2010 (Wednesday) The neutral palladium plating solution "MICROFAB Pd series" for the formation of bumps*1 is available. "MICROFAB Pd Series" is a palladium plating solution that has not been able to achieve a pH 7.0 neutral electrolytic process in the past. It can be used in the packaging technology of a driver IC on a liquid crystal panel. This is to replace the electrolytic gold plating in the mainstream to become the neutral electrolytic palladium plating, and then to reduce the precious metal raw material metal by 75% of the cost*2, and also to match the fine pitch of the liquid crystal drive IC. [The subject of gold bumps in the mainstream of the market and the obstacles encountered in the use of palladium] The wafer bump process of liquid crystal driver ICs is now dominated by gold plating technology. However, in recent years, due to the sudden rise in the market price of gold nuggets, it is imperative to reduce the cost of driving IC packages in the market of liquid crystal panels. In addition, with the high definition of the liquid crystal panel, the miniaturization of the bumps for the driver IC is also required at the same time. In order to prevent the bump from being crushed and the side contact at the time of bonding, it is necessary to form a bump using a noble metal of higher hardness. Since the beginning, attention has been paid to the use of palladium which is cheaper and has a higher hardness than gold. However, the conventional palladium plating has a strong alkalinity, and since it is damaged when the upper photoresist is *3, it is difficult to form a bump for the wafer after the photoresist is applied. [For the first time in the world, using palladium to form bumps] "MICROFAB Pd Series" is a self-developed neutral palladium compound in the neutral range and an additive in the neutral range. It will not be possible to form bumps in a neutral process at pH 7.0. It became possible to become the world's first ※4 neutral electrolytic palladium electrolyte. This technology has the following features, customers can get significant improvements in cost and performance without having to replace existing plating equipment. - By replacing gold plating, the cost of 75% of precious metal raw materials can be reduced - Harder than gold, it forms a clear and flat bump. Corresponding to the miniaturization of the driver IC - Due to the neutral process of pH 7.0, bump plating can be performed on wafers that have been exposed to photoresist - Improved working environment with strong Arma odor in the past due to the lack of smell of Armonia EEJA will target the "MICROFAB Pd Series" to semiconductor wafer production companies with a sales record of 20 million yen per year. In the future, this neutral electrolytic palladium plating process will be extended to printed circuit boards and materials with poor alkali resistance, and the service provision for miniaturization of products and cost reduction will be enhanced. In addition, the EEJA will be on display at the "2010 International Semiconductor Exhibition" held at the Taipei World Trade Center (Taipei, Taiwan) from September 8 (Wednesday) to October 10 (Friday). At the booth of the company (No.1126), in addition to introducing the "MICROFAB Pd Series", the technicians at the exhibition site can also accept your interview. *1 Bump: Electrode terminal such as IC chip *2 With a metal density of 19.32g・cm-3 (20°C), the reference raw material metal price is about 3,400 yen/g (at the end of August 2010). The density of palladium is 12.02 g・cm-3 (20 °C). The price is calculated at approximately 1,400 yen/g (as of August 2010) *3 Photoresist: Film-shaped protective film such as semiconductor wafer and substrate ※4 EEJA survey
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