Taichung Power 200mm epitaxial wafer production line held a groundbreaking ceremony
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On March 25th, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) held a groundbreaking ceremony for the LED R&D center and the 200mm epitaxial wafer production line built in the Hsinchu Science Park. Among them, the production line will be added in two phases. The first phase of the plant started construction. It is scheduled to be introduced into the manufacturing facility in the fourth quarter of 2010 (10-December 2010), and mass production will begin in the first quarter of 2011 (January-March 2011). In the first phase, the investment in workshops, clean rooms and manufacturing facilities was NT$550 million (approximately RMB 116 million). The amount of investment in the second phase will depend on business needs.
At the press conference, Zhang Zhongmou, chairman and CEO of TSMC, said, "To ensure the continued growth of TSMC, we must not only continue to engage in silicon foundry business, but also develop new businesses such as LEDs and solar cells in the future." As part of this, the decision was made to get involved in the LED business. Cai Lixing, general manager of the new business unit, said that “it will enter the LED market in 2011 by providing LED light sources and optical enginesâ€. In this regard, Cai Lixing also said, "We will make full use of our technological leadership and manufacturing advantages in LSI to develop technologies, packaging and testing technologies that integrate LEDs." (Editor: maysoong)