"Samsung LED , let the lighting heart want to happen!" Samsung Electronics, a semiconductor device manufacturer with global brand and patent advantages, has launched a new "Fx-CSP" series, which is the first to adopt CSP (chip-scale package device) and flexible substrate. The combined technology is more suitable for automotive lighting.
Samsung "Fx-CSP" LED automotive lighting device
"The new Fx-CSP series will bring more design flexibility and higher cost performance to the automotive lighting field," said Jacob Tarn, executive vice president of Samsung Electronics LED. He also stressed that "Samsung will continue to introduce innovative LED products and technologies, such as multi-chip array technology, which will play an important role in the development of the automotive LED lighting industry."
The new Fx-CSP family combines CSP and flexible substrate technology to reduce device size and reliability. The use of flexible substrates enhances thermal performance and reduces thermal resistance, resulting in higher luminous efficiency at higher voltages.
In addition, automotive lighting designers can use Fx-CSP to design a variety of different arrangements, such as 1x4 single-chip array or 2x6 multi-chip array to adapt to different lighting configurations, such as position lights, daytime running lights and headlights.
The Fx-CSP series consists of a single device Fx1M and Fx1L series with power 1-3W; a 14x Fx4 for high voltage array and a Fx2x6 series for 40W. Different power levels allow Samsung LED automotive lighting devices to be compatible with a wide range of automotive exterior lighting systems.
Samsung "Fx-CSP" LED automotive lighting device parameters
Samsung's new Fx-CSP product has been used by a world-renowned automaker for automotive headlamp projects, and more Fx-CSPLED automotive lighting components based on CSP technology will continue to be introduced.
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