Gesture-sensing control technology boosts the development of large-screen touch
According to the latest research report of NPD DisplaySearch-Smart Device Gesture Sensing Control for Smart Devices Report, it is expected that by 2015, smart devices (such as mobile phones, tablets, personal computers, game consoles and smart TVs) ) The shipments of the gesture sensing modules used are close to 330 million units, which will increase nearly 70% from the forecasted shipments in 2014 and double the shipments in 2013. In addition to the 2D sensing technology that has been applied to smartphones, tablet computers and smart TVs, the 3D depth sensing technology that was originally applied to game consoles will also gradually mature and reduce costs, and is more suitable for introduction into smart TVs and integrated personal computers ( all-in-one PC) and other large-screen devices. Therefore, NPD DisplaySearch predicts that by 2015, different gesture-sensing control technologies will be more significantly applied to many smart devices. NPD DisplaySearch research director Calvin Hsieh said: Although the touch screen has successfully become the most important and most popular human-machine interface for smartphones, touch interaction may not necessarily be applicable to devices with larger screens; often because of the use of these devices Due to factors such as distance and context, the touch interface has become overwhelmed. Therefore, gesture sensing control technology has become one of the best human-machine interface options for these devices. In particular, applications such as smart TVs have been gradually introduced into the application platform and ecology of smart mobile terminals, but there has been a lack of killer human-machine interfaces like touch interfaces to enhance consumers' experience and willingness to use. Although some gesture-sensing control technologies (such as proximity sensors and 2D cameras) have been successfully applied to some smart mobile devices, the user's demand for more intuitive and efficient human-machine interfaces has driven technology to continue go ahead. Therefore, the sensing control technology capable of detecting 3D depth will have a more prominent role in the future. Smart mobile terminals: Touch screens and micro-electro-mechanical sensors (MEMS) are currently used as the main human-machine interface. Gesture sensing control technology is expected to be used as an auxiliary interface. Smart TVs and devices with larger screens: Touch screens are less conducive to their usage, so gesture-sensing control technology has the opportunity to become the main human-machine interface in the future. At present, Samsung and Chinese TV brands have used the built-in 2D camera for gesture-sensing control. When the depth of 3D technology is mature and the cost is reduced, it will naturally be considered for import. In addition, Apple has incorporated PrimeSense at the end of 2013 to obtain 3D depth of structured light or light coding. It is expected that the most suitable imported product should be the next generation of Apple TV. Game console: Microsoft Xbox has adopted 3D depth sensing control technology since the launch of Kinect in 2010. Sony PlayStation since the fourth-generation console was released at the end of 2013, through the new generation of PS Camera, gesture sensing control has also been pushed to no need to handle The technical level of 3D depth. Personal computer: In addition to the traditional keyboard, mouse and newly introduced touch screen, gesture sensing control technology has not been significantly applied. However, since 2013, under the vision of perceptual computing proposed by Intel, gesture sensing control technology with 3D depth detection capability will be first applied to laptop computers from 2014. Hsieh added: Gesture-sensing control technology has gained the attention of industry leaders and will hopefully become the main human-machine interface on smart devices with larger screens, making up for the lack of user experience of these devices in the way of operation. We have seen that in the past year alone, these leaders have stepped up their efforts. For example, Intel has acquired Omek in Israel, Google has acquired Flutter, Microsoft has used ToF technology (time of flight) that has been deployed for a long time in the new generation of Kinect, and Sony has introduced stereo vision in the new generation of PlayStation 4. PS Camera, and Apple just got structured light technology from PrimeSense. So far, the three major 3D depth gesture control technology has heavyweight supporters.
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Antenk High-Density D-Sub Connectors
Antenk Solder Type D-Sub Connector
Available in standard and high density versions
Supplied with stamped & formed or screw machine contacts.
Standard contact terminations accomodate up to 20 AWG standard wire
Available with white (nylon) or black (PBT) insulators. Standard shell plating is tin
Antenk D-Sub connectors solder cup machined contacts are manufactured according to the standards MIL-C-24308 and DIN 41652. The standard connectors from Antenk are available in all known versions and sizes. They are available in various version with numerous assemblies. The insulating body, a monoblock, complies with the UL94 V-0 standard. The contacts are machined and available in several quality classes.
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Solder cup d-sub available in 5 industry sizes/positions
Standard Density (9 pin, 15 pin, 25 pin, 37 pin, 50 pin)
Tin shells have indents to provide grounding and additional retention.
Screw machine contacts offer high reliability. Non-removable contacts.
Optional mounting hardware available.
Materials of Antenk Solder Cup Standard D-Sub Connector Machined contacts
Shell: Steel, tin plated
Insulator: Glass-filled thermoplastic. U.L. rated 94V-O
(260°C process temp)
Machined contacts:
Male pins - Brass | Female pins - Brass
Plating: Gold flash on entire contact
Contact us for other plating options
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Solder cup d-subs in 4 industry sizes/positions
High Density (15 pin, 26 pin, 44 pin, 62 pin).
Approximately 65% more higher density then standard d-sub connectors.
Screw machined contacts offer high reliability.
Metal Shell provides EMI/RFI shielding. Available in 3 clinch-nut options.
Plug shells have indents to provide grounding & additional retention.
Connectors will fit in standard D-sub backshells.
Contacts will accept (28 - 24) gauge wire.
Materials of Solder Cup High Density D-Sub Machined Contacts
Shell: Steel, Nickel plated
Insulator: Glass-filled, PBT Thermoplastic. U.L. rated 94V-O
(230°C process temp)
Machined contacts: Brass, Gold Flash Plated(contact us for other plating options)
9 pin, 15 pin, 25 pin, 37 pin, 50 pin Male Solder Cup Standard D-Sub Connectors Machined Contacts, Solder Cup High Density D-Sub Machined Contacts,Female Solder Cup Standard D-Sub Connectors Machined Contacts ShenZhen Antenk Electronics Co,Ltd , https://www.pcbsocket.com
Available in cable mount options including crimp & solder cup and the board mount options including Dip Solder, Wire Wrap, High Profile, Right Angle, & Surface Mount (SMT). This comprehensive Antenk High-Density Density D-Sub product offering is available in both stamped & formed and machined contact options.
High density D-Sub connectors, for applications where the best possible contact density is required. Due to the [high" density of the 15, 26, 44, 62 and 78 contacts, this series is ideal for the most modern applications. The insulating body, a monoblock, complies with the UL94 V-0 standard. The contacts are machined and available in several quality classes.