Sun Dong: Wafer specification development history and trend

On August 17th, the LED industry chain procurement matchmaking conference-materials and equipment held in conjunction with the 2012 Gaogong LED Exhibition was successfully held in the afternoon of the opening day of the exhibition. Exhibitors from the middle and upper reaches of the LED industry chain presented their new products and the characteristics and applications of the main products in the market, effectively promoting the centralized face-to-face technical exchange and procurement between exhibitors and buyers. Docking.

Sun Dong, CTO of Hangzhou Dahe Thermomagnetic Electronics Co., Ltd. analyzed the history and trend of wafer specification development. The 2-inch sapphire substrate is the mainstream in the domestic market, and 4 inches and 6 inches are used by advanced manufacturers such as the US and Japan. He pointed out: "Increased substrate size is the only way to increase production capacity and reduce costs." After looking forward to the development trend of electron beam evaporation coating technology, he said that electron beam evaporation is more suitable for reducing costs and expanding output requirements.

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