Sun Dong: Wafer specification development history and trend
Lc Fiber Coupler,Lc To Sc Coupler,Sc To Lc Coupler,Mpo To Lc Adapter Ningbo Fengwei Communication Technology Co., Ltd , https://www.fengweifiberoptic.com
Sun Dong, CTO of Hangzhou Dahe Thermomagnetic Electronics Co., Ltd. analyzed the history and trend of wafer specification development. The 2-inch sapphire substrate is the mainstream in the domestic market, and 4 inches and 6 inches are used by advanced manufacturers such as the US and Japan. He pointed out: "Increased substrate size is the only way to increase production capacity and reduce costs." After looking forward to the development trend of electron beam evaporation coating technology, he said that electron beam evaporation is more suitable for reducing costs and expanding output requirements.