A Reading of the Development of Industry 4.0 Digital Factory
People who are concerned with and familiar with the technology of Industry 4.0, including myself, have always had a lingering doubt. In the 2014 Final Report of the German Industry 4.0, it became clear that the technical route of Industry 4.0 was to shift from "centralized control" to "distributed control." However, in the case of digital factories that were popular and promoted in China from 2015, they are rarely seen in this respect, and many people have doubted the technical route of Industry 4.0. 1.25mm Wire To Board Connectors
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In these current cases, without exception, the core technology demonstrated is to use MES as the backbone system of digital factories to support the centralized control and scheduling concept of the production line. If you want to talk about innovation, it is often the upward connection between ERP and MES, and the communication between the MES and the equipment PLC. It can automatically import production orders, collect data and analyze data in the field, and predict equipment failures. Quality testing or equipment energy analysis.
The business corresponding to these innovations is basically the responsibility of the equipment section, quality inspection department, or power department. They are in an auxiliary position in the production organization and process of the company. Although these innovations are valuable for reducing production costs and improving product quality, their direct contribution to production efficiency is relatively limited.
There are also digital factories that track the production process of each product by installing sensors on the product or tooling, and realize "one-piece flow" production on a single production line. In fact, this kind of order-based configuration of mixed-line production has long been common sense in the automotive industry at the end of the last century.
Domestic Shanghai General Motors has already implemented this kind of mixed-line sorting production more than ten years ago, and it has achieved full coverage of the IT system that sets up the car and connects to the equipment. Its complexity and accuracy are much higher than the popularity of custom clothing and home appliance customization in recent years.
So you can see a very interesting phenomenon - in many industries other than automobiles, there have been many cases of digital factories that are connected by devices, customized or transparent factories. Instead, in the automotive industry, few people use these things as propaganda. The reason is simple - what have you achieved in the automotive industry 20 years ago?
Entering the fifth year of Industrial 4.0, 2018, the auto industry finally has to stand up and talk about it. Everyone knows that the second industrial revolution, which is often referred to as Industry 2.0, is one of the hallmarks of the Ford Motor Line. Today, this production method is used by various industries, and many improvements have been made in the old Ford's assembly line. However, this production method also has a lot of defects, and there are many limitations on the configuration capabilities (quantity, type, etc.) of the products produced, and the fault tolerance of the entire production line is low, and it is easy to restrict the bottleneck of the entire production line. Industry 4.0 distributed control can solve this problem. In the era of Industry 4.0, the automotive industry was once again the leader of technological change.
Taking Audi Automotive in Germany as an example, in its 2030 smart factory planning blueprint, the concept of "Modular Production" was proposed. In this factory, the traditional production line no longer exists, parts are delivered through the drone in the workshop, the customer obtains the body size through 3D scanning to customize the seat, the worker and the robot work together, and the body parts are printed by the 3D printer. ,Automotive driving away from the assembly line by means of automatic driving... In the process of building a smart factory, Audi has a clear understanding of both the current level of intelligent production processes and the leap of technological innovation that will occur in the coming years. planning.
Figure: Future blueprint for Audi's 2030 smart factory
At the Hannover Industry Fair, SAP launched the third-generation open integrated factory OIF (Open Integrated Factory). OIF 3.0 inherited the concept of vertical integration and product customization production on the basis of 1.0 and 2.0, and introduced the “dynamic modular production†technology without streamline production scheduling that is being developed and innovated.
Figure: "Modular production" display of SAP OIF 3.0 at the Hannover Industry Fair site
It should be said that the realization of "dynamic modularization technology" is not an easy task. In the past, we were familiar with confirming the MBOM and the process route, preparing the production plan, using MRP for material decomposition, and finally organizing the production. The practice of being able to change the route by the AGV car at any time is completely subverted. Here, you need completely different algorithms and logic than you did before.
Figure: Dynamic Modular Production Technology
According to the estimation, taking Audi as an example, this kind of dynamic modularization technology can be used to allow enterprises to achieve more product variables while at the same time allowing the production efficiency to be significantly improved.
This will be a huge leap forward for the highly developed German auto industry. The use of Industry 4.0 technology by the automotive industry for the abandonment of traditional assembly line production represents an important development direction for the fourth industrial revolution. We expect that in the near future, there will be similar cases of digital factories in China.
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The comprehensive range consists of terminals, crimp housings and PCB headers in straight and right angle, surface mount and through-hole configurations. It is available in 2 to 15 circuits in a single row. 1.25mm wire-to-board solution conforms to the EU Industry Safety Standard. PCB header material meets halogen-free requirements and can be operated in the temperature range from -40°C to +105°C.
Saves space with a 1.25mm pitch
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Crimp housing with friction feature
Conforms to EU Industry Safety Standard
Accommodates wire range up to 32AWG-28AWG
Features
Three plating versions - Tin 15μin Gold, 30μin Gold and Gold Flash
Fully polarized housings
Crimp housing with friction feature
Tape and Reel packaging with pick up cap
UL94V-0 flammability rated LCP material
Halogen-free resin material
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