Some things to be aware of when reflow soldering

When reflow soldering, be sure to check the following precautions before using.

Welding condition

1. If the capacitor is suddenly heated, a large temperature difference will cause the internal part to deform, causing breakage or a decrease in the bending resistance of the board.

To prevent damage to the capacitor, preheat the capacitor and the mounting board.

The temperature difference ΔT regarding the preheating conditions, the welding temperature, and the surface temperature of the capacitor should be controlled within the range shown in Table 1.

The smaller the ΔT, the smaller the effect on the capacitor.

In addition, it can prevent the phenomenon of stippling, shifting and so on.

2. When the external electrode is tinned, when the solder is soldered at a temperature lower than the melting point of tin, the solder wettability is lowered, resulting in poor soldering. Therefore, be sure to evaluate the installation and check the solderability beforehand.

3. As with the preheating temperature difference, when the cleaning fluid is placed immediately after the welding is finished, an air cooling process should be set to ensure that the cooling temperature difference can meet the ΔT of Table 1.

Solder usage

1. If the solder paste used is too thick, it will lead to excessive soldering in reflow soldering. This can make the patch more susceptible to mechanical and thermal stress than the board, causing the patch to break.

2. Too little solder paste will cause insufficient fixing strength on the external electrodes, causing the patch to fall off the board.

3. Make sure that the solder paste is evenly distributed on the end face and the thickness is at least 0.2mm.

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