Analysis of LTCC technology introduction, comparative advantages, application advantages and technical characteristics
See the filter manufacturer's roadmap is talking about LTCC....LTCC... Not BAW, not FBAR, of course not SAW Is there a consensus? Understand the little friends to talk about, welcome to leave a message Introduction LTCC technology is a new material technology developed by Hughes in 1982. It is made of low-temperature sintered ceramic powder into a precise and dense porcelain belt. It uses laser drilling, microporous grouting and precision conductor paste on the green belt. Process printing and other processes to produce the required circuit pattern, and buried multiple passive components (such as low capacitance capacitors, resistors, filters, impedance converters, couplers, etc.) in the multilayer ceramic substrate, and then stacked together The inner and outer electrodes can be respectively sintered at 900 ° C using silver, copper, gold and other metals to form a high-density circuit that does not interfere with each other in three-dimensional space. It can also be made into a three-dimensional circuit substrate with built-in passive components, which can be attached to the surface. With IC and active devices, passive/active integrated functional modules can be used to further miniaturize and increase the density of circuits, making them particularly suitable for high-frequency communication components. In short, this technology can successfully manufacture a variety of high-tech LTCC products. There are many different methods for integrating passive components of different types and performances in one package, including low temperature co-fired ceramic (LTCC) technology, thin film technology, silicon semiconductor technology, and multilayer circuit board technology. LTC C technology is the mainstream technology for passive integration. LTCC integrated components include products that carry or embed various active or passive components on a variety of substrates. Components for integrated components include components, substrates, and modules. Contrast advantage Compared to other integrated technologies, LTCC has many advantages: First, ceramic materials have excellent high frequency, high speed transmission and wide pass band characteristics. Depending on the ingredients, the dielectric constant of the LTCC material can be varied over a wide range. Combined with the use of high conductivity metal materials as conductor materials, it is beneficial to improve the quality factor of the circuit system and increase the flexibility of circuit design. Secondly, it can adapt to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit board. It greatly optimizes the heat dissipation design of electronic equipment, has high reliability, can be used in harsh environments, and prolongs its use. life; Third, a circuit board with a high number of layers can be fabricated, and a plurality of passive components can be buried therein, thereby eliminating the cost of the package components, and implementing passive and active on a three-dimensional circuit substrate having a high number of layers. Integration helps to increase the assembly density of the circuit, further reducing the size and weight; Fourth, it has good compatibility with other multilayer wiring technologies, such as the combination of LTCC and thin film wiring technology to achieve higher packing density and better performance of hybrid multilayer substrates and hybrid multi-chip components; Fifth, the discontinuous production process facilitates the quality inspection of each layer of wiring and interconnecting vias before the finished product is manufactured, which is beneficial to improving the yield and quality of the multilayer substrate, shortening the production cycle, and reducing the cost. Sixth, energy conservation, material saving, green, and environmental protection have become an irresistible trend in the development of the component industry. LTCC has also catered to this development demand, minimizing the environmental pollution caused by raw materials, waste and production. Application advantage (1) It is easy to realize more wiring layers and increase assembly density; (2) It is easy to embed components, improve assembly density, and realize multi-function; (3) It is convenient to check the quality of each layer of wiring and interconnecting vias before the substrate is fired, which is beneficial to improve the yield and quality of the multilayer substrate, shorten the production cycle and reduce the cost: (4) It has good high frequency characteristics and high speed transmission characteristics; (5) It is easy to form a cavity of various structures, thereby realizing a multifunctional microwave MCM with excellent performance; (6) Good compatibility with thin film multilayer wiring technology, the combination of which can achieve higher assembly density and better performance of hybrid multilayer substrate and hybrid multi-chip module (MCM-C/D); (7) It is easy to realize a multi-layer wiring and package integrated structure, further reducing the volume and weight, and improving reliability. Due to its unique advantages, LTCC technology will be used to make surface-assembled components in next-generation mobile communications, which will show great advantages. Technical characteristics The use of LTCC to prepare chip passive integrated devices and modules has many advantages. First, ceramic materials have excellent high-frequency and high-Q characteristics. Second, the use of high-conductivity metal materials as conductor materials is beneficial to improve the quality factor of the circuit system. Third, it can adapt to the requirements of high current and high temperature resistance, and has better thermal conductivity than ordinary PCB circuit substrates. Fourth, passive components can be buried in the multilayer circuit substrate, which is beneficial to increase the assembly density of the circuit; Fifth, it has better temperature characteristics, such as a small thermal expansion coefficient and a small dielectric constant temperature coefficient, and can produce a circuit board having an extremely high number of layers, and can form a thin wire structure having a line width of less than 50 μm. In addition, the discontinuous production process allows the green substrate to be inspected, thereby increasing yield and reducing production costs. One of the significant advantages of LTCC devices is their consistency and accuracy. This depends entirely on the stability of the materials used and the precision of the process equipment. There are no production plants in the country that can manufacture molding equipment related to LTCC. According to incomplete statistics, China Southern Glass has introduced a complete LTCC production line. In addition, about 4 research institutes have introduced or are introducing LTCC pilot equipment to develop military LTCC modules. T Copper Tube Terminals,Non-Insulated Pin-Shaped Naked Terminal,Copper Cable Lugs Terminals,Insulated Fork Cable Spade Terminal Taixing Longyi Terminals Co.,Ltd. , https://www.longyicopperterminals.com
